Product Summary
The PS21865-AP is a dual-in-line package intelligent power module.
Parametrics
PS21865-AP absolute maximum ratings: (1)Supply voltage: 450V; (2)Supply voltage (surge): 500V ; (3)Collector-emitter voltage: 600V; (4)Each IGBT collector current: 20A; (5)Each IGBT collector current (peak): 40A; (6)Collector dissipation: 52.6W; (7)Junction temperature: -20℃ to 125℃.
Features
PS21865-AP features: (1)Employing 5th generation planar IGBT chips with 0.6μm design rule or CSTBT technology with superior loss performance; (2)Ultra compact dual or single-in-line transfer mold package (compatible with 2nd generation); (3)Including driver and protection circuitry (UV, SC); (4)DIP-IPM with reduction of thermal resistance by 20%; (5)2500Vrms isolation voltage; (6)High-active interface logic for direct connection to a 3V or 5V MCU; (7)Highest reliability and optimised EMI performance; (8)Available from 3A to 50A / 600V for motor ratings from 0.1kW to 3.7kW; (9)Optional with open emitter topology for vector control; (10)All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals; (11)From January 2006 onwards, all DIP and Mini-DIP-IPMs will be supplied with completely lead-free technology.
Diagrams
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